Project Summary

        This system continuously transmits 16 thermocouple readings via a TI MSP430F149 microcontroller and a TRF-2.4G wireless transceiver. It is designed to be sensitive to a wide range of temperatures (100 - 1400 ^oC). The transmit-side electronics are protected from these extreme temperatures as they are housed in a heat-shielding box.

  Files

• Project Schedule (04/16/05): This is the timeline during which we were required to design, implement, test, and produce a working prototype.

• System Diagram (04/04/05): This is the high-level design of the multi-channel temperature measurement system with telemetry.

• Concept Screening Matrix (02/21/05): This is the matrix used to guide design details such as part selection, part configuration, and system parameters.

• Requirements Allocation Table (04/16/05): This is a table listing the customer requirements for this system and the subsequent system specifications.

• Thermocouple linearity analysis (J- and K-type) (01/25/05): In order to achieve a desired temperature resolution, the linearity of the thermocouple-amplifier pair must be sufficient. This analysis demonstrates sufficient linearity in the parts chosen for this circuit.

• Thermocouple linearity analysis (R- and S-type) (02/03/05): Because of the fact that software can correct for non-linearity in the thermocouple voltage versus output, these types of thermocouples may be used.

• Temperature Capture Assembly (TCA) (04/16/05): This is the block diagram for the TCA. This circuitry samples all 16 thermocouples as well as the ambient temperature and sends the information wirelessly to the RF Repeater array.
• Click here to see a picture of the prototype.

• RF Repeater (RFR) Module (04/16/05): This is the block diagram for the RFR module. This subassembly receives wireless temperature data from the TCA and then serially forwards it on to the PC Interface module.
• Click here to see a picture of the prototype.

• PC Interface Assembly (PCIA) (04/16/05): This is the block diagram for the PCIA. This subassembly receives temperature data from an array of receivers (RFRs) and then interfaces with the PC via a USB port to transfer the data.
• Click here to see a picture of the prototype.
• Click here to see a picture of the RFR and PCIA interfaced.

• Prototype cost (04/16/05): This document details the estimated cost of a prototype.

• Project Proposal (01/31/05): This is the Project Proposal detailing our intent, plan, and expectations for this project.

• System Level Design Report (02/21/05): This is the System Level Design Report detailing the architecture, capabilities, and other specifics of our design.